The d:mension™ 5100 Mobile Surround Microphone is a completely self-contained plug-and-play solution for 5.1 audio capture. It brings engaging surround ambience to sport events, documentaries and other HDTV productions. This microphone is versatile and can be mounted in many ways:, microphone stand, suspended from the ceiling or via a handgrip. It is lightweight and portable. It can also withstand inclement weather conditions due to its robust nature.
The d:mension™ 5100 Mobile Surround Microphone uses five miniature pressure transducers. These transducers have low sensitivity to wind and mechanical noise, low distortion and low frequency response. They also have a large dynamic range.
The three front microphones in this system are time aligned to eliminate comb filtering. This also ensures frequency consistency when down mixing to stereo or mono. In contrast, the rear microphones, with standard omnidirectional patterns, are optimally spaced from both each other and the front array to simulate the most natural time arrival differences. The end result of DPA’s innovative design approach is a surround atmosphere that is rich, smooth and fully enveloping, great in its coherence, channel separation and localization accuracy. The d:mension™ 5100 Mobile Surround Microphone requires no external signal processing.
This solution is targeted at surround sound recording for film, live, broadcast and studio applications. Using full surround sound is an amazing way to record a symphony. Most orchestras are a self-balancing phenomena – each instrumental part can be heard without the need for additional miking. As well, acoustic reflections and a sense of acoustic space are an important aspect of the sound of an orchestra - just as much as the instruments themselves.
For sports applications, the d:mension™ 5100 is easy to set up. It is a no worry, 5.1-ambience solution that is placed centrally to cover the main camera shot and backed up by the usual spot mics for additional effects.
The 5.1 output of the microphone runs through a multipin Lemo connector. This connector carries all six electronically-balanced channels.
The 5100 Mobile 5.1 Surround Mic comes with:
- A five-meter (16 ft), six-pair Mogami cable that breaks out to six Neutrik XLR-M connectors from a Lemo Multipin
- An Outdoor Cover (OC5100) that protects the 5100 against rain and reduces wind noise.
DPA Microphones d:mension™ 5100 Mobile 5.1 Surround Mic
Directional pattern
Directional
Principle of operation
Pressure, with interferece tube and separation baffles
Cartridge type
Pre-polarized condenser element
Effective frequency response
L, C, R, LS, RS: 20 Hz to 20 kHz; LFE: 20 Hz to 120 Hz
Frequency range, ±2 dB
L, C, R: 200 Hz to 16 kHz; LS, RS: 100 Hz to 12 kHz; LFE: 20 Hz to 120 Hz
Sensitivity, nominal, ±3 dB at 1 kHz
L, C, R: 26 mV/Pa; LS, RS: 28 mV/Pa
Equivalent noise level, A-weighted
L, C, R: Typ. 18 dB(A) (max. 21 dB(A)); LS, RS: Typ. 20 dB(A) (max. 23 dB(A))
Equivalent noise level, ITU-R BS.468-4
L, C, R: Typ. 29 dB (max. 32 dB); LS, RS: Typ. 31 dB (max. 34 dB)
Distortion, THD < 1%
120 dB SPL RMS, 123 dB SPL peak
Dynamic range
L, C, R, LS, RS: 103 dB; LFE: 100 dB
Max. SPL, THD 10%
132 dB SPL peak
Rated output impedance
50 Ω
Cable drive capability
100 m (328 ft)
Output balance principle
Active Signal balanced
Common mode rejection ratio (CMRR)
60 dB, 50 Hz - 20 kHz
Power supply (for full performance)
48 V Phantom power
Current consumption
Typ. 5 mA (max. 5.5 mA)
Connector
Lemo multipin
Color
Black
Weight
500 g (17.6 oz)
Microphone diameter
W: 240 mm (9.4 in), H: 140 mm (5.5 in), D: 195 mm (7.7 in)
Capsule diameter
5.4 mm (0.21 in)
Cable length
5 m (16.4 ft)
Cable color
Black
Cable diameter
9.3 mm (0.37 in)
Maximum output voltage
L, C, R, LS, RS: 1,8 Vrms / 2,5 Vpeak; LFE: 1 Vrms / 1,4 Vpeak
Polarity
Positive
Temperature range
-40°C to 45°C (-40°F to 113°F)
Relative humidity (RH)
Up to 90%
2-Year warranty by serial number. Does not cover wear and tear by analysis of DPA Microphones A/S. Two-way shipping to be borned by buyer unless product is found to be defective by manufacturing defects.
